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Mintchell Video Report - Pack Expo 2011 Recap

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FILED IN:  PAC, PLC, I/O Modules
     
Gary Mintchell, Editor in Chief, provides a recap of the 2011 PACK EXPO trade show, held Sept. 26-28 in Las Vegas, NV. Trends noted by Gary Mintchell include modular I/O, motion buses, modularity and Ethercat. Report also includes information on the OMAC packaging group. (Approximate time- 5:46).

FILED IN: PAC, PLC, I/O Modules
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