Video | October 17, 2011
Mintchell Video Report - Pack Expo 2011 Recap
Gary Mintchell, Editor in Chief, provides a recap of the 2011 PACK EXPO trade show, held Sept. 26-28 in Las Vegas, NV. Trends noted by Gary Mintchell include modular I/O, motion buses, modularity and Ethercat. Report also includes information on the OMAC packaging group. (Approximate time- 5:46).
E-Book Special Report
Networks: Wired & Wireless
Sign up to receive timely updates from our editors and download this FREE Special Report exploring the most widely adopted protocols for fieldbus, Ethernet and wireless networking in the process industries, as well as the latest trends in wireless applications.