Video |
October 17, 2011
Pack Expo 2011: Process to Packaging Innovation
Mike Wagner, Global Packaging Business Manager, Rockwell Automation, talks about the company's offering at the largest packaging show in 2011. Topics include OMAC, PackML, plant-wide optimization for end-users and integrating process and discrete line operations for quicker time to market. (Approximate time - 1:50)
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