Video | October 17, 2011
Pack Expo 2011: Process to Packaging Innovation
Mike Wagner, Global Packaging Business Manager, Rockwell Automation, talks about the company's offering at the largest packaging show in 2011. Topics include OMAC, PackML, plant-wide optimization for end-users and integrating process and discrete line operations for quicker time to market. (Approximate time - 1:50)
E-Book Special Report
Networks: Wired & Wireless
Sign up to receive timely updates from our editors and download this FREE Special Report exploring the most widely adopted protocols for fieldbus, Ethernet and wireless networking in the process industries, as well as the latest trends in wireless applications.