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Turck: TURCK Analog I/O Module Increases Application Flexibility with Current and Voltage Signal Combination

http://www.automationworld.com/Turck%204AI4AO-VI%20analog%20I/O%20module

Turck: TURCK Analog I/O Module Increases Application Flexibility with Current and Voltage Signal Combination

The new TURCK 4AI4AO-VI analog I/O module offers compatibility with two of the company’s BL distributed I/O products: BL67 and BL Compact system. Featuring four analog inputs for current or voltage and four analog outputs for voltage, the module provides both control and feedback in one convenient package.

The 4AI4AO-VI is designed for use with TURCK’s BL67 modular I/O system and BL Compact system. BL67 combines all of the flexibility of an in-the-cabinet I/O system with modularity, ruggedness and connectorization, while the BL Compact system is a revolutionary on-the-machine solution that obtains and transmits signals via diverse fieldbus protocols, without requiring a protective enclosure. Supporting both M8 and M12 I/O connectors and offering compatibility with a variety of communication protocols, such as Ethernet/IP, DeviceNet, CANopen and Modbus TCP, the BL family provides a high degree of I/O versatility for a wide range of applications.

“The combination of both voltage and current analog signal types in one module provides users with unique I/O flexibility,” said Don Eichman, Product Specialist for TURCK. “The signal duality of the 4AI4AO-VI, which merges control and feedback functions into a single I/O card, and its compatibility with our already versatile BL family allows our customers to increase overall efficiency, reliability and accuracy for any I/O application.”

For enhanced application compatibility, the 4AI4AO-VI is ruggedly constructed to withstand diverse environmental challenges. Operating in temperatures ranging from -40 to 70 degrees Celsius, rated to IP67 and UL listed, the module provides optimal performance in applications that yield extreme temperatures, moisture, shock or vibration—accommodating even the most demanding application requirements.

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