FEATURED ARTICLE

If Not Now, Soon

Equipment, guidelines and standards are making steady progress toward the goal of truly modular, networkable end-of-line options.

A solid argument could be made that packaging equipment should not only be the first factory floor systems on the manufacturing network, but also the first to be linked to the enterprise network as well. Packaging operations, after all, could be a fairly effective indicator of a manufacturer’s end-stage operations.

Packaging data, of course, can tell you how much good product is coming off the line. More importantly, these data can offer a window to trends to be avoided, such as growth in finished goods inventories - and to trends of joy, such as on-time availability of product urgently wanted by customers. Possible also are insights into quality assurance and traceability. Finally, networked packaging allows you to extend methodologies used for productivity improvement and capital efficiency in other parts of the factory to the packaging line as well.

Unfortunately, however, the results of one recent survey indicate that many manufacturers are out of touch with these benefits, in more ways than one. The OMAC Users Group Packaging Workgroup’s Packaging Automation Survey indicates that more than 60 percent of end-of-line equipment is not networked. The OMAC (Open Modular Architecture Control) Users Group and Packaging World put together the survey, the results of which were announced this year. OMAC describes itself as dedicated to the development and use of open, interoperable control and automation systems for end-users, technology providers and original equipment manufacturers (OEMs). Read more...

ANNOUNCEMENT

Looking for a few facts and figures to impress the boss?

See what topics made the headlines over the past several months and enhance your business acumen in the process. Automation Worldıs PDF collections contain the best of recent articles and are organized by topic: Best Editorials, Business Skills, IT Skills and Control System Skills.
Click for details >>

ANNOUNCEMENT

Last year’s Packaging Automation Forum SOLD OUT!

Secure your place at Packaging Automation Forum 2007, May 23rd at the Chicago O’Hare Marriott. Professionals from market-leading companies will share their secrets for getting the most from today’s packaging controls and information technology.
Click for details >>