SICK to Host Virtual Press Conference at PACK EXPO Connects

See what’s new with SICK at its first ever virtual press conference for PACK EXPO Connects. There will be four live demos of its intelligent sensor solutions that are helping to improve the packaging process.

This content was submitted directly to this website by the supplier.

P1ekk01623va91vdovrnoostqq7 001

Register for our virtual press conference to see how intelligent sensors are changing the landscape of industrial automation!

Date: Wednesday, November 4, 2020

Time: 2 – 3 p.m. (CST)

Location: Online via WebEx

Press Conference Demo Agenda:

•3D vision robotic belt pick solution

• Comprehensive robotic safety solutions

• Improvements in automated print inspection without using OCR

• Top-notch virtual safety services available through SICK

Click here to visit our virtual showroom.

PACK EXPO Connects–November 9-13. Now more than ever, packaging and processing professionals need solutions for a rapidly changing world, and the power of the PACK EXPO brand delivers the decision makers you need to reach. Attendee registration is open now.

Companies in this article
More in Home