Automation Insights from PACK EXPO 2014

Dec. 22, 2014

Key Technology-Focused Interviews from PACK EXPO 2014 in Chicago

Industry 4.0 Meets the Internet of Things

With a PC-based architecture at its core, Beckhoff Automation highlights the intersection of Industry 4.0 and the Internet of Things at PACK EXPO 2014.

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Machine Development Software Modules

To demonstrate how the engineering time needed to develop automated machines can be significantly reduced, Lenze showcased its FAST application software at PACK EXPO 2014.

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The Gateway Approach to Ethernet Migration

As older automation technologies fade away and the push to use Ethernet continues, more manufacturers are facing a dilemma in how to strategically migrate to newer systems. At PACK EXPO 2014, ProSoft Technology highlighted its gateway approach to phased migration.

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Packaging Machinery Trends: Communicatons and Mobile

As a non-exhibiting automation supplier at PACK EXPO, Opto 22’s Benson Hougland came to observe, learn, and see where today’s technology trends could be heading.

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About the Author

David Greenfield, editor in chief | Editor in Chief

David Greenfield joined Automation World in June 2011. Bringing a wealth of industry knowledge and media experience to his position, David’s contributions can be found in AW’s print and online editions and custom projects. Earlier in his career, David was Editorial Director of Design News at UBM Electronics, and prior to joining UBM, he was Editorial Director of Control Engineering at Reed Business Information, where he also worked on Manufacturing Business Technology as Publisher.