This durability sets it apart from commodity COM Express modules. Extended mechanical construction protects the module, which is designed for optional conformal coating for greater resistance to moisture, dust, chemicals, and temperature extremes. Dynamic thermal management optimizes uptime and helps prevent damage to the system. The latest R-Series System-on-Chip (SoC) from AMD gives it both superior throughput and extensive graphics capabilities. As well as supporting up to 16 GBytes of memory, the module supports four SATA interfaces, a Gigabit Ethernet port, eight USB 2.0 and four USB 3.0 ports and either eight GPIO ports or an SD Card interface. Operating temperature is -40°C (-40 ºF) to +85°C (185 ºF) (CPU dependent), while storage temperature is -40°C to +105°C (221 ºF), and operating humidity is 10% to 90%.
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