OMAC Presents PackML Workshop at The Automation Conference

March 31, 2015
The half-day training session, May 18 at the Chicago Marriott O’Hare, provides PackML fundamentals and applications in packaging and non-packaging related automation

The Organization for Machine Automation and Control (OMAC). in partnership with The Automation Conference 2015, is presenting a half-day workshop on implementing PackML to increase productivity. The workshop, titled “PackML—Automation Efficiency in Packaging and Beyond,” is exclusively for attendees of The Automation Conference and takes place May 18, 1-5 p.m., at the Chicago Marriott O’Hare. The Automation Conference, produced by Automation World and Packaging World, is May 19-20 at the same location.

The workshop is tailored to automation professionals, packaging end users, OEMs, and other professionals who want to learn more about best practices in implementing PackML and potential applications in other automated systems. Topics include applying PackML in packaging and non-packaging related automation; implementing best practices; using templates to create consistent, reusable machine code; and the relation to developing total cost of ownership (TCO) guidelines and overall equipment effectiveness (OEE) in packaging.

The presenters will also discuss functional elements that make packaging systems more productive. Attendees will receive usable templates, a walkthrough of P&G’s implementation system used by more than 200 developers, and a roadmap for identifying the right PackML elements for your machines and lines.

Presenters include:

• Lee Smith, Lead Software Engineer, Mettler Toledo Safeline, will share Mettler Toledo’s experiences of implementing PackML on its range of Product Inspection devices including how the combination of PackML with other industrial standard communication protocols provides a complete integration/connectivity solution for customers.

• Arthur Smith, senior automation controls engineer, Corning Inc., will discuss experiences in implementing PackML in non-packaging related automation. He has more than 15 years of automation and controls experience, and led Corning’s first implementation of PackML in non-packaging related production.

• Steve Schlegel, managing director, The Alliance for Innovation & Operational Excellence (AIOE), will discuss PackML in relation to the development of total cost of ownership (TCO) guidelines and OEE in packaging.

• Doug Buschor, E-Technologies Group, will provide practical resources, tools and guidelines on implementing PackML on packaging lines. He will share implementation best practices, templates for reusable machine code, and functional elements of PackML. Buschor has been an integrator on numerous packaging lines for P&G and others that have successfully implemented PackML to improve efficiency.

The Automation Conference is designed for manufacturing, processing and packaging professionals, and provides opportunities to discover practical applications and share best practices in automation and controls, manufacturing systems, engineering, software development, machine design, line integration, operations and line performance.

Class size for the PackML Workshop is limited to encourage personalized attention and time for questions and answers. The workshop is available exclusively for registered attendees of The Automation Conference, and requires an additional registration fee of $250 for OMAC members and $350 for non-members. To register, please visit

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