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Micro-Measurements Introduces StrainBond Service

Micro-Measurements, a Vishay Precision Group, Inc. (VPG) brand, today introduced a new design, installation, and customization service for transducers built on foil strain gages.

Drawing on the extensive PhotoStress® experimental stress analysis experience of VPG's recently acquired Stress-Tek, Inc., StrainBond™ provides engineers with full transducer support from development through installation. Services include initial assessment, specification of strain gages, bonding and wiring, environmental protection, prototyping, and machining large and small quantities.

"With our StrainBond service, we are combining the well-known design and application strengths from Stress-Tek with the unmatched strain gage expertise of Micro-Measurements to provide engineers with a one-stop shop for all their strain gage needs," said Yuval Hernik, Micro-Measurements senior director of applications engineering and marketing. "The result is unprecedented capabilities that are now available for solving the most difficult foil strain gage bonding and transducer projects expediently, efficiently, and on budget."

Micro-Measurements' design capabilities include the use of the PhotoStress method of photoelasticity, a visual, full-field technique for determining stresses. Coatings of photoelastic materials are applied directly to the test specimen's surfaces. When photoelastic materials are strained and viewed under polarized light, colored fringe patterns are seen. Interpretation of these patterns leads to an unparalleled understanding of the overall field and permits the measurement of the magnitude and direction of the strains at any point — resulting in unique designs and approaches for optimized positioning of strain gages.

The PhotoStress method provides an invaluable aid when choosing strain gage locations, gage size, and optimal gage geometry — unique advantages in the market. In addition, visualization of the response to applied loads helps optimize the design of the structure for lowest weight, maximized strength, efficient production, and high accuracy — even for complicated structures or very high maximum weight capacities — while also identifying areas of excess material and stress concentrations.

"Through our Stress-Tek acquisition, we are pleased to expand our ability to provide consultation, full custom design, and production services to meet the needs of customers in North America," added Hernik. "PhotoStress was a VPG innovation, and it continues to be a unique component in analyzing the target application, developing the sensor design, determining optimal gage location, and ensuring high-quality sensor assembly, calibration, and testing."

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