New multifield TDI camera captures brightfield, darkfield and backlit images in a single scan

Dec. 2, 2019
Teledyne DALSA’s new 16k multifield camera detects previously undetectable defects at industry’s highest speeds

Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to announce the availability of its newest charge-domain CMOS TDI camera – the Linea HS 16k Multifield TDI camera. Multifield imaging allows end-users to capture multiple images e.g. brightfield, darkfield, and backlit images simultaneously in a single scan.

Based on a multi-array TDI sensor architecture, the 16k camera offers 100-kHz x 3 line rate or 5 GPix/sec data throughput for high-performance imaging applications such as flat panel display, PCB and wafer inspection, life science, aerial imaging and web inspection.

A first in the industry, the Linea HS 16k Multifield camera uses integrated dichroic filters with minimum spectral crosstalk to spectrally isolate and capture up to three field images e.g. brightfield, darkfield and backlit in a single scan. Combined with advanced lighting, multifield significantly improves tact time and detectability.

“For demanding applications like OLED display automatic optical inspection (AOI), end-users currently need to scan multiple times in various lighting conditions to detect defects. With the new Linea HS Multifield camera, customers can complete what used to require three separate passes in a single scan.   This significantly boosts the data throughput of an AOI system and with it, improved detectability,” said Xing-Fei He, Senior Product Manager for Teledyne DALSA’s line scan portfolio. 


Combined with Teledyne’s  Xtium™2 CLHS series of high-performance frame grabbers, these new products represent a breakthrough  in data throughput. Built on field-proven technology, the next generation CLHS fiber optic interface provides reliable and high throughput data transmission. Fiber optic cables lower system costs, offer longer cable lengths (up to 300 m), are immune to electromagnetic radiation, and are ideal for industrial environments. Teledyne DALSA’s Xtium2 family of high-performance frame grabbers feature the PCI Express Gen 3 x8 platform.

Key Features:

    • High speed of up to 100k-Hz x 3 line rate in 16k resolutions, or 5 Gpix/sec
    • Minimum spectral crosstalk
    • Very low noise and high sensitivity
    • Active pixel assisted alignment
    • Camera Link HS fiber optic interface for high reliability and long cable data transmission  
    • Lowers system costs


Please visit the Linea HS product page for more information. For sales enquiries, visit our contact page, and for full resolution images, our online media kit.

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