Teledyne DALSA expands its Xtium2 frame grabber series with three new CoaXPress models

Dec. 2, 2019
New CXP v2.0 frame grabbers support data transfer rates of up to 5 GB/s

Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, announces its Xtium™2-CXP series of high-performance frame grabbers. The new series transfers image data to the host memory at maximum acquisition rates with zero CPU utilization, allowing host applications to operate at maximum efficiency.

The Xtium2-CXP series is compatible with CoaXPress® version 2.0 and uses the PCI Express Gen3 x8 platform to deliver sustained image acquisition bandwidth of up to 6.8 GB/s to the host memory. The Xtium2-CXP frame grabber series supports image acquisition rates of up to 12.5Gbs and models are available in 4, 2 and 1-channel configurations. The Xtium2 series is fully supported by Teledyne DALSA’s free Sapera LT SDK.

With its 2 GB of image memory, the Xtium2-CXP prevents data loss when the PCIe bus is being utilized by other devices in the system, and data cannot be transferred for processing. Fully compatible with Teledyne DALSA’s Trigger-To-Image Reliability (T2IR) framework, the new CXP boards deliver ready-to-use images and support both area and line scan monochrome, RGB and Bayer color cameras.

“The Xtium2-CXP series combines high performance image acquisition with our T2IR framework making it an ideal choice for demanding applications in a growing number of industries,” said Senior Product Manager, Inder Kohli.

When combined with the industry’s newest and highest resolution cameras, the Xtium2-CXP series frame grabbers enable some of the most demanding vision applications.

Xtium2-CXP Key Features:

  • Half-length PCIe Gen3 x8 board, with 4 micro-BNC coaxial connectors
  • Maximum image acquisition bandwidth of up to  5.0GB/s, maximum host bandwidth up to 6.8GB/s
  • Supports CXP 1.x and 2.0 cameras with 4, 2 or 1 output channels of up to 12.5Gbs/ channel
  • Simultaneous acquisition from multiple independent cameras

To learn more about the new Xtium2-CXP series please drop by our booth #D-01 at the International Technical Exhibition of Image Technology and Equipment 2019, December 4-6, in Yokohama, Japan.

 

Visit the Xtium2-CXP product page for more information. For sales enquiries, visit our contact page, and for full resolution images, our online media kit.

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