Ten different organizations came together to test their implementations of 6LoWPAN, IPv6, and COAP, the new protocol being developed by the IETF for embedded devices. At the interoperability event, members of the Alliance demonstrated device and protocol interoperability showing the path to building the Internet of Things.
"A key goal of the IPSO Interop is to show that products and services using IP for Smart Objects can work together and meet industry standards for communication," said Kris Pister, chief technologist at Dust Networks and chair of the IPSO Interop Committee. "This interop successfully highlights the wide variety of standards that interoperate within the IP framework, including the forthcoming IEEE 802.15.4e low power wireless standard."
During the interop event, devices using multiple different communications technologies including 802.15.4, 802.15.4e and powerline communications (PLC) shared command and control information directly between devices at the event, as well as with devices located at other participants' sites around the world. IPSO member companies that participated in the interop were Convergence Wireless, Dust Networks, NXP Semiconductor, Proto6, Sensinode, Symphony Networks, Ubilogix and Watteco. Geoff Mulligan, Chairman of the Alliance, said, "This interoperability event builds on our two previous interops by showing not only multiple different media, but also higher layer functional interoperability."
At future interop events, the Alliance will expand the testing of the IP protocol suite for use in embedded networks and systems, such as those being planned for the Smart Grid, automated building and industrial process controls.
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