Endicott Interconnect Technologies Names Raj Rai Chief Technology Officer

Oct. 10, 2012
Endicott Interconnect Technologies, Endicott, N.Y. announced the promotion of Rajinder Rai to the position of Chief Technology Officer (CTO) reporting to James J. McNamara Jr., President and CEO.

Endicott Interconnect Technologies (www.endicottinterconnect.com), Endicott, N.Y.  announced the promotion of Rajinder Rai to the position of Chief Technology Officer (CTO) reporting to James J. McNamara Jr., President and CEO. In his new position, Rai will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress and assessing the potential of new product introduction.

"Raj has demonstrated his sound knowledge of advanced electronics materials and packaging, process development and new product introduction. His combination of advanced degrees and knowledge of science, leading and managing key technical projects, activities in a highly creative environment and then converting those developments into commercialized products for market, has positioned him for his new role as EI's Chief Technology Officer. I have confidence in Raj's ability to lead his Research and Development Team and continue to move EI forward as a leading edge, high technology company," said Jay McNamara, CEO of EI.
EI delivers high-performance electronics packaging solutions including printed circuit board fabrication, semiconductor packaging fabrication, and complex assembly solutions.Customers include IBM, Cisco, Boeing, Northrop Grumman, and others. It began in 2002 as the successor to IBM’s microelectronics division (formed in 1966) and now has 1,400 scientists, engineers, and innovators, said McNamara.

Rai brings 16 years of experience in the high-tech electronics industry. He has held a variety of Senior Design and Development Engineering positions as well as various Senior Management and Executive roles, most recently as Vice President of Engineering at EI. Raj has been successful and possesses particular expertise in driving new business opportunities, most recently through EI's Integrated Circuit and Assembly Services (ICAS) business.
Raj holds a BS in Materials Science and Engineering from the University of Notre Dame and an MS in Materials Science from Stevens Institute of Technology. He has been issued 6 US Patents and authored more than 25 Technical Papers over the course of his career.
EI's former CTO, Voya Markovich, retired on September 28, 2012

Endicott Interconnect Technologies

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