B&R introduces automation technology that takes packaging machinery performance to a new level at PACK EXPO 2014

B&R Industrial Automation will exhibit its latest packaging solutions at booth S-3179 at PACK EXPO International, November 2-5, 2014 in Chicago’s McCormick Place, where, along with the new co-located Pharma EXPO, over 50,000 packaging professionals will come together.

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B&R Industrial Automation will exhibit its latest packaging solutions at booth S-3179 at PACK EXPO International, November 2-5, 2014 in Chicago’s McCormick Place, where, along with the new co-located Pharma EXPO, over 50,000 packaging professionals will come together.

With flexible I/O solutions, modern industrial multi-touch HMIs, modular drive systems and Panel PCs that implement the latest Intel® Atom technology, B&R solutions provide the performance, flexibility and interoperability necessary for advanced packaging machinery automation. B&R utilizes open communication protocols, and modular, standards-based software programming and data handling for control systems that simplify integration and operation.

Easier and faster programming with modular software
B&R will present the revolutionary mapp technology, which supplements familiar programming languages such as ladder logic with modular, easily configured, IEC compliant software blocks to cut the software development process by up to 70%, while reducing service and maintenance costs. The mapp elements integrate seamlessly into B&R's automation software environment, so developers working with B&R’s Automation Studio software can implement mapp blocks to make their work easier and their application software clearer.

PACK EXPO and Pharma EXPO attendees can also learn about B&R’s reACTION technology solution that can deliver unprecedented I/O response rates as fast as 1 µs by executing directly in the intelligent IP20 and IP67 rated I/O modules instead of up in the PLC. Packaging applications include more compact design and precise actuation for reject stations, cutting and seal bars, print mark detection and collation.

Opening the lines of communication
POWERLINK, the deterministic real-time protocol for standard industrial Ethernet, will also be presented in the B&R booth. This open source Ethernet protocol can address both data and control needs on a single wire, while reducing design costs, minimizing system jitter, and achieving maximum system performance. B&R will display a live demonstration featuring the Cognex® In-Sight® 7000 series vision system, which communicates via POWERLINK and incorporates visualization and control technology for high-speed and high-precision product monitoring in production line operation.

De-hyping 'The Internet of Things'
Many new terms are entering the automation lexicon surrounding ‘The Internet of Things’ as big money begins chasing big data. They include Industrial Internet, Industry 4.0 and the fourth industrial revolution. At the Pharma EXPO Conference session, Convergence: The Connected Machine, on Monday, November 3rd, 8:00-8:50 am, PACK EXPO and Pharma EXPO attendees can hear B&R’s John Kowal, board member of OMAC and PMMI, explain how to separate the hype of 'The Internet of Things' from the practical for pharmaceutical processing and packaging automation.

B&R supports education
For the fourth year in a row, B&R Industrial Automation’s Packaging Solutions Group is sponsoring the PACK Solutions Challenge. This year’s competition tasked bright young student teams from PMMI Partner universities with developing a dedicated line to package and ship the new retail-ready line of all-beef jerky treats from the fictional “Ray’s Premium Pet Food Company.” PACK EXPO and Pharma EXPO attendees can visit the Education and Workforce Development Pavilion to view the students’ projects and vote for their favorite solution. The winning team will be announced on Tuesday, November 4th during the Packaging Hall of Fame event at the Hyatt Regency McCormick Place.

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