ITW Dynatec has recently restructured its operations to establish a dedicated Packaging Group exclusively focused on the needs of packaging original equipment manufacturers (OEMs) and end user companies. The company will feature its growth-oriented solutions for the packaging market at Pack Expo 2015, Las Vegas Convention Center, Las Vegas, NV, September 28-30, Booth C-3301.
OEMs Strategic Focus on Packaging OEMs
Scott Holzwarth, the recently appointed Global Business Unit Manager - Packaging for ITW Dynatec commented, “Our goal at Pack Expo 2015 is to reaffirm to packaging OEMs that we’re the smart choice for their hot melt adhesive requirements. We have developed exclusive programs for packaging OEMs that combine best-in-class hot melt solutions with competitive pricing, to help our OEM partners meet both performance and margin requirements.” Holzwarth acknowledges that there are several other hot melt providers in the market. “We want to remind packaging OEMs that we’re one of them, and that they have options,” he added. By designing all of its equipment to work with other industry standard componentry, ITW Dynatec makes the introduction of its hot melt applicators and components to existing packaging lines simple and straightforward, easing the concern of being locked into a single provider’s equipment.
ITW Dynatec already has an established presence in the North American packaging landscape. The company serves OEMs throughout the world, ranging from regional to multinational organizations that incorporate ITW Dynatec’s hot melt technology into the automated assembly of corrugated boxes, cartons, trays, cases and other packaging formats requiring precise adhesive application. ITW Dynatec customers represent the full spectrum of consumer packaged goods, including food and beverage, health and beauty, pharmaceutical, household, pet and industrial products.
OEM partners benefit from ITW Dynatec’s premiere field service and support team that readily deploys to facilities worldwide to provide onsite engineering, training and consultative support to ensure optimum performance of its hot melt systems. “This is especially valued among our emerging and regional OEM partners, who may sometimes get lost in the shuffle when working with larger suppliers,” Holzwarth added. Several ITW Dynatec facilities also feature ‘proof of process labs,’ where interested customers are invited to experience an on-site, first-hand evaluation of various hot melt assemblies in action.
Featuring the Top-Performing BF Microbead Applicator
ITW Dynatec will be demonstrating its popular BF MicroBead Applicator at Pack Expo. One of its top-performing and most widely used applicators, the BF MicroBead is available with single-port or dual-port pivoting modules, providing flexibility for set-up and reduction in the number of applicators required. “Built-in-Filtration” (BF) is an ITW Dynatec applicator feature that prevents nozzle clogging and reduces cross-contamination to virtually eliminate downtime. Rapid cycle speeds make the BF MicroBead applicator ideal for high-speed applications like carton forming and sealing. An air open/air close design provides precise adhesive patterns and bead placement, and an adjustable needle stroke sets adhesive flow for extreme accuracy. An integrated needle and self-cleaning nozzle virtually eliminates adhesive stringing. The applicator’s compact design is both easy to install and to maintain.
The "Original" Melt-on-Demand Technology
ITW Dynatec’s patented Melt-on-Demand hopper works in conjunction with its Dynamelt® adhesive supply units. With Melt-on-Demand, not all adhesive in the hopper needs to be melted for the unit to function. This enables the system to be operation-ready much faster than conventional equipment. Their unique Melt-on-Demand technology virtually eliminates the problem of charring and reduces equipment maintenance time. ITW Dynatec was the first company to introduce melt-on-demand technology in North America in the 1960s, and has continued to improve this technology over the last 50 years.
ITW Dynatec Team at Pack Expo This Year
In addition to Scott Holzwarth, a group of ITW Dynatec hot melt experts and technicians will be attending Pack Expo this year. One recent addition to the team who will be in attendance is Gina Powers, ITW Dynatec’s recently appointed Vice President and General Manager. A long-time ITW professional, Powers also was a participant in ITW’s Early in Career program, an integrated development process designed to accelerate the readiness of leadership talent.
ITW Dynatec to Host Packaging Hospitality Suite at Pack Expo
ITW Dynatec invites all attending and exhibiting packaging OEMs and manufacturers to its hospitality suite, which will be open throughout the Pack Expo show in the North Hall. Complimentary refreshments and lunch will be provided to all attending packaging customers and prospects, where they can also learn about ITW Dynatec’s exclusive partnership and support programs.
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