ASCO, the world’s leading manufacturer of comprehensive fluid automation solutions, today announced it has begun accepting applications for its 2016 Industrial Automation Engineering Scholarship program.
ASCO will award two $5,000 scholarships to U.S. engineering students, provide $1,000 grants to their college’s engineering departments, and host the students at “The Amazing Packaging Race” at PACK EXPO International in 2016.
The application period is now open and the deadline to apply is April 3, 2016.
"ASCO’s engineering scholarship program will continue to provide opportunities for today’s engineering students," said Robert W. Kemple, Jr., executive vice president, sales and marketing – Americas, ASCO. "At ASCO, engineering and innovation are at the heart of everything we do. We are proud to continue our role in supporting the education of the world's next-generation of engineering leaders"
Over the past 9 years, ASCO has awarded $80,000 in scholarships to 16 students based on their potential for leadership and for making a significant contribution to the industrial automation engineering profession. In addition, ASCO has provided another $16,000 in grants to the engineering departments of the colleges in which the winners are enrolled.
The ASCO scholarship is merit-based and will be awarded on the candidate’s potential for leadership and for making a significant contribution to the industrial automation engineering profession, particularly as it relates to the application of fluid control and fluid power technologies. A panel of ASCO executives and independent judges will select the finalists.
To apply, students must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2016/2017 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale, and be a U.S. citizen or legal U.S. resident. The deadline to apply is April 3, 2016.
ASCO will award the scholarships at “The Amazing Packaging Race” at PACK EXPO International, to take place in Chicago from November 6 - 9, 2016. The race, sponsored by ASCO, is a fun and educational event that pits teams of packaging students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.
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