Pentair Launches Schroff embeddedNUC Case with Integrated Cooling Solution

Pentair is introducing its first compact Schroff case with an integrated cooling solution and compliant with the 'embeddedNUC' standard.

This content was submitted directly to this website by the supplier.

Aw 49154 Default Embeddednuc

Pentair is introducing its first compact Schroff case with an integrated cooling solution and compliant with the 'embeddedNUC' standard. Based on the Schroff Interscale platform of cases, the new Schroff embeddedNUC case consists of just three parts—body, top cover and front panel—and offers standard platform flexibility in dimensions, cutouts, colors and printing. The EMC-shielded case is simple to assemble and is fixed in place with just two screws. Heat sinks for conduction cooling are integrated in the top cover. In addition, Pentair has developed and patented special thermally conductive elements in metal to transfer the heat from the processors to the case surface. These elements are variable in height, allowing them to stay in constant contact with processors of different heights. The dissipated heat is transferred consistently by conduction to the heat sinks and then passed to the environment by means of convection and radiation. Direct heat dissipation also enables better processor performance and higher clock speeds.

“The new Schroff embeddedNUC case with integrated cooling provides a unique and robust solution for industrial applications,” said Marc Caiola, North America Electronics Protection Platform Leader, Pentair. “The compact case allows users to protect and effectively cool their powerful PC units, while enabling decentralized control and monitoring.”

Developed by the SDT.03 working group of the SGET e.V. standardizing consortium, the standard is based off Intel's Next Unit of Computing (NUC) system for consumer applications. To extend the benefits of the system to industrial applications, embeddedNUC takes into account the interfaces relevant to industrial applications, the long-term availability of processors and other electronic components and failsafe, fan-less conduction cooling. With this standard, small and powerful PC units can now be used as decentralized control and monitoring units in automation systems.

As a member of the SGET e.V. standardization consortium, Pentair played an active role in the SDT.03 working group. In particular, Pentair contributed its expertise in conceptual case design and effective passive cooling. The specification defines the electronic parameters concerning connectors, power supply and interfaces, in addition to mechanical aspects such as the size of the board (101.60 mm x 101.60 mm) with the fixing holes and the heights and positions of the electronic components on the front and rear sides of the board. The basic width and depth dimensions of a case are determined by the board size. The height of the case remains variable, since it has to be adapted to the height of the electronic components and to the conduction cooling. Similarly, cutout locations on the front or rear of the case for connectors remain undefined as these depend on the application. The defined temperature range for operation lies between 0 and +60 °C or extended from -40 to 85 °C.

>> For more information on this product, click  here

Companies in this article
More in Home