This completely solid state system is compatible with a wide range of Intel and VIA-based Mini-ITX form factor motherboards, enabling flexibility. The GS-L05 system uses heat pipe/heat sink technology for passive cooling that
eliminates reliability concerns that fanned cases can present when used in harsh, demanding or remote environments. Rugged steel and heat dissipating aluminum create a tough, protective enclosure with black-box looks, mounting brackets, and set-it-and-forget-it reliability, says the vendor. The system is also said to offer a price/performance advantage over other form factors tailored for embedded applications.
Logic Supply Inc.
802.244.8302
![Mark Perlin[51]](https://img.automationworld.com/files/base/pmmi/all/image/2022/09/MarkPerlin_51_.63374e7cea411.png?auto=format%2Ccompress&fit=crop&h=167&q=70&w=250)
