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OMAC at Pack Expo

The OMAC Packaging Workgroup at its Pack Expo  booth, C-64 in the Grand Concourse, will feature  seven demonstrations:

• PackConnect demo from Ethernet Powerlink that includes hardware from B&R, Baldor, Parker, Lenze,  Eckelmann

• PackConnect demo from EtherCAT that includes  hardware from Beckhoff, Baumiller, AMK, SEW

• PackConnect demo from ProfiNET that includes  hardware from Siemens, SEW, Lenze, Danfoss

• PackConnect demo from SERCOS that includes  hardware from Bosch Rexroth, AMK

• PackML demo from Wago

• PackML demo from Elau

• PackML demo from Rockwell

“We’ll have many of the major control suppliers participating, and with these demos, we should generate a lot of interest and support for our OMAC Packaging Workgroup guidelines,” says OMAC technical director Dave Bauman.

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