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    OMAC at Pack Expo

    Oct. 9, 2006
    The OMAC Packaging Workgroup at its Pack Expo  booth, C-64 in the Grand Concourse, will feature  seven demonstrations:
    • PackConnect demo from Ethernet Powerlink that includes hardware from B&R, Baldor, Parker, Lenze,  Eckelmann• PackConnect demo from EtherCAT that includes  hardware from Beckhoff, Baumiller, AMK, SEW• PackConnect demo from ProfiNET that includes  hardware from Siemens, SEW, Lenze, Danfoss• PackConnect demo from SERCOS that includes  hardware from Bosch Rexroth, AMK• PackML demo from Wago• PackML demo from Elau• PackML demo from Rockwell“We’ll have many of the major control suppliers participating, and with these demos, we should generate a lot of interest and support for our OMAC Packaging Workgroup guidelines,” says OMAC technical director Dave Bauman.

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