Intended for OEMs designing computing platforms into equipment for industrial or harsh environments to whom reducing the overall design cycle and lowering validation costs are key, this COM Express module separates the carrier card from the processor; this extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone and reduces long term cost of ownership while ensuring that performance keeps pace with changing needs. On-board components are selected for their reliability in demanding conditions, and processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for resistance to moisture, dust, chemicals, and temperature extremes. For systems integrators looking for solutions that deliver high performance coupled with low power consumption, the unit offers a range of five VIA Nano and VIA Eden processor options, with performance between 800 MHz and 1.2 GHz (x2) and power consumption between 3.5W and 13.0W. Up to 8 GB of DDR3 SDRAM can be configured.
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