Distributed I/O Modules

The Flex 5000 I/O platform from Rockwell supports real-time, intelligent process control.

Distributed I/O Modules
Distributed I/O Modules

The platform’s higher-speed connectivity and expanded bandwidth deliver increased amounts of data back to the controller, which helps future-proof control systems. It is built on a Gigabit architecture with communications supporting Device Level Ring (DLR), linear and star topologies. A future release will support Parallel Redundancy Protocol (PRP) for a redundant network topology. The I/O modules are suitable for both OEMs and process operations. Engineering time is reduced with simplified wiring and design, and installation is eased with a flexible architecture that includes vertical and horizontal mounting and copper and fiber media options. Removal and insertion under power (RIUP) allows technicians to replace existing I/O, and an online change capability allows configuration of new I/O, both while the system continues to run. In addition, the flexibility to configure alarms, events and diagnostics at the channel level helps drive maintenance efficiency. Operating temperatures range is -40 to 70 ºC.

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Rockwell Automation

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