Mintchell Video Report - Pack Expo 2011 Recap
Gary Mintchell, Editor in Chief, provides a recap of the 2011 PACK EXPO trade show, held Sept. 26-28 in Las Vegas, NV. Trends noted by Gary Mintchell include modular I/O, motion buses, modularity and Ethercat. Report also includes information on the OMAC packaging group. (Approximate time- 5:46).
Oct 17th, 2011