Acromag Expands Their Line of Ethernet Remote I/O Modules with RTD Temperature Measurement Options

Aug. 17, 2022
New high-density Ethernet I/O modules monitor RTD or resistance sensor types for industrial applications.

Acromag’s newest addition to the Busworks® NT Series of expandable remote Ethernet I/O modules is the NT2620 Series RTD/resistance module. Designed to be a cost-effective modular solution, it supports four RTD/resistance inputs and two bidirectional discrete digital I/O channels to monitor temperature limits with conditional logic. NTE Ethernet I/O models have dual RJ45 ports and a webserver with Modbus TCP/IP or EtherNet/IPTM communication to monitor or control the internal I/O channels.

The Modbus TCP/IP or EtherNet/IPTM communication is field-selectable saving costs of additional modules. An integrated DIN rail bus allows a connection of up to three NTX expansion I/O modules. The space-saving design requires only 25mm of DIN rail per module. Ethernet I/O modules distribute 9-32V DC power along the DIN rail bus to expansion modules. Hazardous location approvals, high noise immunity, and -40 to 70°C operation make this I/O ideal for use in harsh environments.

“Now Acromag can interface a wider variety of temperature sensors and offer discrete signals to monitor threshold levels or control alarms,” states Robert Greenfield, Acromag’s Business Development Manager.

Profinet communication is planned for release soon. Each module will support all three protocols which are selectable using any web browser to configure the network settings and I/O operation. The modules typically function as a network slave, but also offer Acromag’s i2o® peer-to-peer communication technology to transfer data between modules directly without a host or master in between. Multicast capability is included.

Acromag, a mid-sized international corporation, has been developing and manufacturing measurement and control products for more than 60 years. They offer a complete line of industrial I/O products including process instruments, signal conditioning equipment, data acquisition boards, distributed I/O systems, and communication devices.         

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