I/O and RFID connectivity for CC-Link

Balluff's IP67 CC-Link I/O modules and supporting cordsets provide a full I/O and RFID connectivity solution for CC-Link, and enable the consistent, cost-optimized implementation of requirements using decentralized installation technology.

Nov 22nd, 2010
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The IP67 CC-Link I/O modules can be used to simplify the way most CC-Link I/O Networks are run by placing the modules near the concentration of sensors and actuators. The smaller footprint and ease of setup reduces installation material costs and labor, as well as decreases maintenance troubleshooting and repairs. Product features include: I/O Module; unique push-button display allows for easy configuration right at the block;  IP67 rugged metal housing that withstands harsh industrial environments; ports that accept 2- or 3-wire inputs; cordsets and accessories; auxiliary power cordsets and more.

Balluff
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High Pressure Processing Helps Emerging Brands
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View Product Demos On Demand
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View Product Demos On Demand
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Check out The Cobot Spot from Universal Robots
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More in Control
Baumergroup
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IDEC Adds 12V DC 16 I/O CPUs to MicroSmart FC6A PLC
With the addition three new 12V DC CPUs, the capable MicroSmart FC6A All-in-One PLC family now offers users more options for automating battery-backed systems, traffic controls, and mobile equipment.
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Laser Direct Structuring (LDS)—The structure of the conductor path is applied using the LDS process. LDS enables electronic assemblies to be made in flexible geometric shapes. Smart phones, hearing aids, and smart watches are becoming smaller and more powerful thanks to this process.
Electronic Assemblies Without PCBs
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New DC/DC Converter Designed for Extreme Environments
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