This completely solid state system is compatible with a wide range of Intel and VIA-based Mini-ITX form factor motherboards, enabling flexibility. The GS-L05 system uses heat pipe/heat sink technology for passive cooling that
eliminates reliability concerns that fanned cases can present when used in harsh, demanding or remote environments. Rugged steel and heat dissipating aluminum create a tough, protective enclosure with black-box looks, mounting brackets, and set-it-and-forget-it reliability, says the vendor. The system is also said to offer a price/performance advantage over other form factors tailored for embedded applications. Logic Supply Inc. www.logicsupply.com802.244.8302
eliminates reliability concerns that fanned cases can present when used in harsh, demanding or remote environments. Rugged steel and heat dissipating aluminum create a tough, protective enclosure with black-box looks, mounting brackets, and set-it-and-forget-it reliability, says the vendor. The system is also said to offer a price/performance advantage over other form factors tailored for embedded applications. Logic Supply Inc. www.logicsupply.com802.244.8302
