B&R Showcases New Automation Technologies at Pack Expo 2012

Oct. 5, 2012
B&R Industrial Automation will present its latest packaging solutions at the industry’s premier event, PACK EXPO International 2012 (booth 4337).

B&R Industrial Automation will present its latest packaging solutions at the industry’s premier event, PACK EXPO International 2012 (booth 4337).

In addition to the B&R products featured at its own booth, several OEMs at the show will exhibit packaging machines using B&R technology. B&R specializes in standards-based, scalable and modular control systems integrating logic, motion, robotics, human-machine interface (HMI), safety, I/O and data acquisition in a unified software development environment.

New products
New product introductions at PACK EXPO will include the latest Automation Panel HMI with multi-touch functionality developed specifically for industrial environments. The ergonomically designed, 21.5” full HD touch screen device resembles an oversized iPad®. The innovative multi-touch technology can make machine operation more intuitive, faster, and safer.

B&R complements its line of distributed, machine-mountable IP65 rated servo and stepper drives with the new ACPOSmuilti65m, a new family of integrated servo motor/drives that feature flexible mounting and cabling options, onboard I/O and advanced safe motion functions.  Distributed drive technology saves valuable control cabinet space, reduces installation cost through quick-connect cables, and promotes modular machine design with easy expansion.

Networked & integrated safety
In contrast to hardwired safety PLCs and circuits, B&R’s integrated safety solution runs on the same Ethernet Powerlink network and integrates with B&R controllers and I/O. contributes to productivity with diagnostics, safe motion, safe robotics and zoning, without requiring full machine shut downs. B&R safety devices monitor, prevent, and react to machine faults to help increase efficiency and reduce energy consumption and downtime.  

Other B&R highlights at PACK EXPO include an energy management module that contributes to better energy efficiency and easier monitoring, and a new IP65 rated keypad module that has the compact dimensions of a mobile phone.

Powered by B&R
Exhibitors from North America, Europe and developing markets will feature B&R powered packaging machinery at PACK EXPO covering the full range of primary, secondary and end-of-line packaging processes.

B&R supports education
This year’s PACK EXPO Student Packaging Solutions Contest will be sponsored by B&R Industrial Automation’s Packaging Solutions Group for the second year in a row.  Student teams will be challenged to implement innovative packaging controls into their design for a weighing, filling and case-packing system for snack maker Jackson Snack Foods Company.

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